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CFMEE

330.800

-11.200-3.27%

Volume:114.70K

Turnover:38.88M

Market Cap:48.46B

PE:134.51

High:347.600

Open:337.000

Low:330.400

Close:342.000

52wk High:555.000

52wk Low:228.000

Shares:146.51M

HK Float Shares:14.76M

Volume Ratio:2.37

T/O Rate:0.78%

Dividend:- -

Dividend Rate:- -

EPS(LYR):2.459

ROE:15.28%

ROA:7.80%

PB:17.17

PE(LYR):134.51

PS:24.72

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Overview Company News Filings

CFMEE's Pre-IPO Trading Soars Over 65%, Generating Significant Gains Per Lot

HK Grey Market | Keytop Parking Jumps 160%; CFMEE Jumps 66%; WengeAI Jumps 58%; SG Micro Jumps 33%

Tiger Newspress

CFMEE Publishes New Articles of Association Following Hong Kong H-Share Listing, Sets Out Governance Structure and Dividend Policy

Bulletin Express

CFMEE Sets Final Offer Price at HK$252.73 Per Share

CFMEE Prices Hong Kong IPO at HK$252.73 per Share; Trading to Start 26 June 2026

Bulletin Express

CFMEE's Hong Kong IPO Oversubscribed 194 Times, Indicating Strong Investor Demand

CFMEE's Global Ambitions: A New Chapter from the STAR Market to the Hong Kong Exchange

Hong Kong's IPO Pipeline Swells as Six Firms Launch Deals, Eyeing HK$20 Billion in Combined Haul

MT Newswires Live

Circuit Fabology Microelectronics Seeks Up to HK$3.2 Billion in Hong Kong IPO

MT Newswires Live

集成电路光刻设备企业推出全球发售，最高募资逾30亿港元

Bulletin Express

Circuit Fabology Microelectronics Equipment Sets HK$252.73 Top Price for 12.84 Million-Share Hong Kong IPO

Bulletin Express

BRIEF-Circuit Fabology Microelectronics Equipment Co Announces Maximum Offer Price Of HK$252.73 Per H Share Under Global Offfering

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The...","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09630"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1143252165","title":"CFMEE Sets Final Offer Price at HK$252.73 Per Share","url":"https://stock-news.laohu8.com/highlight/detail?id=1143252165","media":"Stock News","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1143252165?lang=en_us&edition=fundamental","pubTime":"2026-06-24 18:30","pubTimestamp":1782297041,"startTime":"0","endTime":"0","summary":"The final offer price for the global offering has been set at HK$252.73 per share.This price excludes the 1.0% brokerage commission, the 0.0027% SFC transaction levy, the 0.00565% SEHK trading fee,...","market":"sg","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK0251","EWH","09630","688630"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1130903119","title":"CFMEE Prices Hong Kong IPO at HK$252.73 per Share; Trading to Start 26 June 2026","url":"https://stock-news.laohu8.com/highlight/detail?id=1130903119","media":"Bulletin Express","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1130903119?lang=en_us&edition=fundamental","pubTime":"2026-06-24 18:25","pubTimestamp":1782296751,"startTime":"0","endTime":"0","summary":"Circuit Fabology Microelectronics Equipment Co., Ltd. (CFMEE) confirmed on 24 June 2026 that the offer price for its H-share global offering has been set at HK$252.73 per share, exclusive of...","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09630"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1133330339","title":"CFMEE's Hong Kong IPO Oversubscribed 194 Times, Indicating Strong Investor Demand","url":"https://stock-news.laohu8.com/highlight/detail?id=1133330339","media":"Stock News","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1133330339?lang=en_us&edition=fundamental","pubTime":"2026-06-22 20:21","pubTimestamp":1782130898,"startTime":"0","endTime":"0","summary":"Initial public offering subscriptions for CFMEE (HKEX: 09630) are currently oversubscribed by 194 times, based on the margin financing provided by brokers.The company's offering period runs until...","market":"other","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"2","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK0251","688630","09630","EWH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1181723384","title":"CFMEE's Global Ambitions: A New Chapter from the STAR Market to the Hong Kong Exchange","url":"https://stock-news.laohu8.com/highlight/detail?id=1181723384","media":"Stock News","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1181723384?lang=en_us&edition=fundamental","pubTime":"2026-06-22 10:17","pubTimestamp":1782094673,"startTime":"0","endTime":"0","summary":"As artificial intelligence and high-performance computing reshape the global semiconductor industry, lithography equipment, a core component of chip manufacturing, is entering a critical period of...","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["159982","HEXmain","09630","688630","BK0251"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2644904167","title":"Hong Kong's IPO Pipeline Swells as Six Firms Launch Deals, Eyeing HK$20 Billion in Combined Haul","url":"https://stock-news.laohu8.com/highlight/detail?id=2644904167","media":"MT Newswires Live","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2644904167?lang=en_us&edition=fundamental","pubTime":"2026-06-17 12:53","pubTimestamp":1781672025,"startTime":"0","endTime":"0","summary":"Hong Kong's listing market remained robust as six companies launched initial public offerings on Wednesday, collectively targeting nearly HK$20 billion in gross proceeds.The latest offerings come as c","market":"sg","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.mtnewswires.com/","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"mtnewswires_news","symbols":["09630","01688","03661","002600","02272","300661","01956","SG9999002463.SGD","06228"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2644279231","title":"Circuit Fabology Microelectronics Seeks Up to HK$3.2 Billion in Hong Kong IPO","url":"https://stock-news.laohu8.com/highlight/detail?id=2644279231","media":"MT Newswires Live","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2644279231?lang=en_us&edition=fundamental","pubTime":"2026-06-17 10:36","pubTimestamp":1781663782,"startTime":"0","endTime":"0","summary":"Circuit Fabology Microelectronics Equipment  launched its Hong Kong initial public offering on Wednesday, seeking to raise up to HK$3.24 billion.The Chinese printed circuit board maker is offering 12.8 million H-shares at an indicative price of HK$240.09 to HK$252.73 per share, according to a Hong Kong bourse filing.The offering comprises 1.28 million shares for Hong Kong investors and 11.55 million shares for international investors, subject to reallocation and the overallotment option.The offer price is expected to be determined by June 24, with allocation results due by June 25, ahead of the company's planned trading debut on June 26.Net proceeds will be used to expand the company's production capacity and research and development capabilities. Proceeds will also be used for strategic investments and acquisitions to support the business.The company secured 19 cornerstone investors who committed to purchasing $196.6 million worth of IPO shares.China International Capital Corp., CMB I","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.mtnewswires.com/","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"mtnewswires_news","symbols":["IPOS","09630","BK0251","688630"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1161687867","title":"集成电路光刻设备企业推出全球发售，最高募资逾30亿港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1161687867","media":"Bulletin Express","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1161687867?lang=en_us&edition=fundamental","pubTime":"2026-06-17 06:35","pubTimestamp":1781649325,"startTime":"0","endTime":"0","summary":"-- 公司概览 --   CIRCUIT FABOLOGY MICROELECTRONICS EQUIPMENT CO., LTD.（下称“公司”）主要从事直接成像（Direct...","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"集成电路光刻设备企业推出全球发售，最高募资逾30亿港元","news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09630"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1167180976","title":"Circuit Fabology Microelectronics Equipment Sets HK$252.73 Top Price for 12.84 Million-Share Hong Kong IPO","url":"https://stock-news.laohu8.com/highlight/detail?id=1167180976","media":"Bulletin Express","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1167180976?lang=en_us&edition=fundamental","pubTime":"2026-06-17 06:23","pubTimestamp":1781648595,"startTime":"0","endTime":"0","summary":"Circuit Fabology Microelectronics Equipment Co., Ltd. has launched a Hong Kong IPO for up to 12.84 million H shares under a Global Offering structure, aiming to list on the Hong Kong Stock Exchange...","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09630"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2644794524","title":"BRIEF-Circuit Fabology Microelectronics Equipment Co Announces Maximum Offer Price Of HK$252.73 Per H Share Under Global Offfering","url":"https://stock-news.laohu8.com/highlight/detail?id=2644794524","media":"Reuters","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2644794524?lang=en_us&edition=fundamental","pubTime":"2026-06-17 06:07","pubTimestamp":1781647665,"startTime":"0","endTime":"0","summary":"BRIEF-Circuit Fabology Microelectronics Equipment Co Announces Maximum Offer Price Of HK$252.73 Per H Share Under Global Offfering June 17  - CIRCUIT FABOLOGY MICROELECTRONICS EQUIPMENT CO 688630.SS: NUMBER OF INTERNATIONAL OFFER SHARES UNDER GLOBAL OFFERING 11.6 MILLION H SHARESMAXIMUM OFFER PRICE UNDER GLOBAL OFFFERING HK$252.73 PER H SHARENUMBER OF OFFER SHARES UNDER GLOBAL OFFERING 12.8 MILLION H SHARESFurther company coverage: 688630.SS ","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20260616:nFWN42O0P7:1","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["688630","BK0251","09630"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":5,"pageCount":5,"totalSize":92,"code":"91000000","status":"200"}]}}